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3d ic stacking technology
Ajay Kumar
(Author)
·
Banqiu Wu
(Author)
·
Sesh Ramaswami
(Author)
·
McGraw-Hill Companies
· Hardcover
3d ic stacking technology - Wu, Banqiu ; Kumar, Ajay ; Ramaswami, Sesh
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Synopsis "3d ic stacking technology"
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers: High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology
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The book is written in English.
The binding of this edition is Hardcover.
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