Share
Advanced Flip Chip Packaging
Tong, Ho-Ming ; Lai, Yi-Shao ; Wong, C. P. (Author)
·
Springer
· Paperback
Advanced Flip Chip Packaging - Tong, Ho-Ming ; Lai, Yi-Shao ; Wong, C. P.
£ 154.27
£ 171.41
You save: £ 17.14
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My WishlistsIt will be shipped from our warehouse between
Thursday, July 11 and
Friday, July 12.
You will receive it anywhere in United Kingdom between 1 and 3 business days after shipment.
Synopsis "Advanced Flip Chip Packaging"
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.