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Advanced Liquid Metal Cooling for Chip, Device and System
Jing Liu
(Author)
·
World Scientific Publishing Company
· Hardcover
Advanced Liquid Metal Cooling for Chip, Device and System - Liu, Jing
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Origin: U.S.A.
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It will be shipped from our warehouse between
Monday, July 29 and
Monday, August 05.
You will receive it anywhere in United Kingdom between 1 and 3 business days after shipment.
Synopsis "Advanced Liquid Metal Cooling for Chip, Device and System"
This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category -- liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.
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