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Testing of Interposer-Based 2.5d Integrated Circuits
Krishnendu Chakrabarty
(Author)
·
Ran Wang
(Author)
·
Springer
· Paperback
Testing of Interposer-Based 2.5d Integrated Circuits - Wang, Ran ; Chakrabarty, Krishnendu
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Origin: U.S.A.
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Synopsis "Testing of Interposer-Based 2.5d Integrated Circuits"
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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