Share
Through Silicon Vias: Materials, Models, Design, and Performance
Brajesh Kumar Kaushik; Vobulapuram Ramesh Kumar; Manoj Kumar Majumder; Arsalan Alam (Author)
·
Crc Press
· Paperback
Through Silicon Vias: Materials, Models, Design, and Performance - Brajesh Kumar Kaushik; Vobulapuram Ramesh Kumar; Manoj Kumar Majumder; Arsalan Alam
£ 41.39
£ 45.99
You save: £ 4.60
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My WishlistsIt will be shipped from our warehouse between
Wednesday, July 10 and
Monday, July 15.
You will receive it anywhere in United Kingdom between 1 and 3 business days after shipment.
Synopsis "Through Silicon Vias: Materials, Models, Design, and Performance"
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
