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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Tae-Kyu Lee
(Author)
·
Thomas R. Bieler
(Author)
·
Choong-Un Kim
(Author)
·
Springer
· Paperback
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability - Lee, Tae-Kyu ; Bieler, Thomas R. ; Kim, Choong-Un
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Synopsis "Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability"
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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